Global Wafer Processing Equipment Market Report 2021: Breakdown by Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment – ResearchAndMarkets.com

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DUBLIN – (COMMERCIAL THREAD) – The report “Wafer Processing Equipment Global Market Report 2021: COVID-19 Impact and Recovery to 2030” has been added to ResearchAndMarkets.com offer.

The global wafer processing equipment market is expected to grow from $ 175.21 billion in 2020 to $ 189.78 billion in 2021 at a compound annual growth rate (CAGR) of 8.3%. The market is expected to reach $ 257.5 billion in 2025 at a CAGR of 7.9%.

The major players in the wafer processing equipment market are Lam Research Corporation, Tokyo Electron Limited, Applied Materials Inc, SPTS Technologies Limited, Plasma-Therm LLC, Hitachi Kokusai Electronic Inc, and Taiwan Semiconductor Manufacturing Company Limited.

The wafer processing equipment market includes the sales of wafer processing equipment by entities (organizations, independent traders or partnerships) that manufacture wafer processing equipment used for wafer processing, which is a thin slice of semiconductor, such as crystalline silicon (c -Si), used for the manufacture of integrated circuits and, in photovoltaics, for the manufacture of solar cells. Only goods and services traded between entities or sold to final consumers are included.

The growing demand for miniaturized wafers with improved device performance is a dominant trend in the wafer processing equipment market. Semiconductor substrates such as wafers are thinned down to final thicknesses of a few tens of m. Most semiconductor wafers such as those used in memory, CIS and power applications are thinned down to 100m-200m.

Further reduction in thickness with the need to maximize the memory capacity of individual packages, improved data transfer rates, power consumption mainly powered by mobile applications is required in the case of memory devices. Standard memory devices such as 2D NAND / DRAM use silicon wafers greater than 200m thick.

By 2025, the thickness of 3D stacked DRAM is expected to continue to decrease from 50 to 30m thickness for silicon substrates. Currently, BSI CIS inserts are the thinnest inserts in all applications with a thickness less than 10m. Thus, ultra-smooth surfaces and thinner wafers to be incorporated into devices have steadily gained in popularity in recent years.

The Wafer Processing Equipment Market covered in this report is segmented by Equipment Type into Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Others, by End Use in Medical, Military, Solar, industrial, others.

In 2019, Applied Materials, Inc., a U.S. provider of semiconductor manufacturing equipment, services and software, acquired Kokusai Electric Corporation for $ 2.2 billion. With the acquisition of Kokusai Electric Corporation, Applied Materials, Inc. plans to expand the company’s portfolio in unique wafer processing systems, with technology and manufacturing centers in Tokyo, Cheonan, Korea, Toyama and in Japan. Kokusai Electric Corporation, a Japanese manufacturer of semiconductor equipment, provides services to memory, foundry and logic customers.

The growing demand for consumer electronics devices is expected to drive the growth of the wafer processing equipment market. An increase in demand for electronic products has increased customer expectations for improving the characteristics of new electronic devices. Several consumer electronics and identity solutions, including ID tags, smart cards, etc., are combined with RFID and use wafers for manufacturing integrated circuits. There is an increasing demand for these ultra-smooth surfaces and thinner pads by customers for smooth incorporation into electronic devices.

In addition to this, the increasing use and consumption of consumer electronics devices are expected to fuel the demand for semiconductors, which in turn is expected to propel the wafer processing equipment market revenue during the period. forecast.

The huge investment requirements for semiconductor manufacturing are expected to limit the growth of the market. The need for high investment is the biggest challenge in setting up semiconductor manufacturing units. The initial investment for setting up a semiconductor manufacturing unit is around $ 8 billion and is expected to increase further in the coming years.

In addition, high maintenance and continuous technological upgrading add to the extra cost, acting as a major constraint for setting up semiconductor manufacturing facilities. This scenario is expected to hamper the demand for wafer processing equipment in the semiconductor industry.

Main topics covered:

1. Summary

2. Characteristics of the wafer processing equipment market

3. Platelet Processing Equipment Market Trends and Strategies

4. Impact of COVID-19 on platelet processing equipment

5. Size and growth of the wafer processing equipment market

5.1. Global historical wafer processing equipment market, 2015-2020, in USD billion

5.1.1. Market drivers

5.1.2. Market constraints

5.2. Global Platelet Processing Equipment Forecast Market, 2020-2025F, 2030F, in USD Billion

5.2.1. Market drivers

5.2.2. Market constraints

6. Market segmentation of wafer processing equipment

6.1. Global wafer processing equipment market, segmentation by equipment type, history and forecast, 2015-2020, 2020-2025F, 2030F, in USD billion

  • Oxidation systems

  • Diffusion systems

  • Epitaxial reactors

  • Photolithography equipment

  • Others

6.2. Global wafer processing equipment market, segmentation by end use, history and forecast, 2015-2020, 2020-2025F, 2030F, in USD billion

  • Medical

  • Military

  • Solar

  • Industrial

  • Others

6.3. Global wafer processing equipment market, segmentation by application, history and forecast, 2015-2020, 2020-2025F, 2030F, in USD billion

  • MEMS

  • RFID

  • CMOS image sensor

  • Others

7. Regional and country analysis of the wafer processing equipment market

7.1. Global wafer processing equipment market, divided by region, historical and forecast, 2015-2020, 2020-2025F, 2030F, in USD billion

7.2. Global wafer processing equipment market, divided by country, historical and forecast, 2015-2020, 2020-2025F, 2030F, in USD billion

Companies mentioned

  • Lam Research Company

  • Tokyo Electron Limited

  • Applied Materials Inc

  • SPTS Technologies Limited

  • Plasma-Therm LLC

  • Disco Corporation

  • Tokyo Seimitsu Co Ltd. (Accretech)

  • Motorola Solutions Inc

  • KLA-Tencor Corporation

  • Hitachi Kokusai Electronics Inc

  • Taiwan Semiconductor Manufacturing Company Limited

  • Intelligence

  • Nikon Corporation

  • Samsung

  • DISPLAY Semiconductor Solutions Co. Ltd.

  • VE Group

For more information on this report, visit https://www.researchandmarkets.com/r/mrrjr8


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